i.MX 952 Applications Processor: High-Performance AI Vision Processing

i.MX-952
Preproduction
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The i.MX 952 applications processor is designed for AI-powered sensor fusion and vision sensing applications, supported by the integrated eIQ® Neutron Neural Processing Unit (NPU). It features advanced graphics and video cores, powerful vision and machine learning (ML) acceleration and efficient CPU performance with real-time processing. Part of the EdgeVerse™ portfolio of intelligent edge solutions, it offers advanced security with integrated EdgeLock® secure enclave to support energy-efficient edge computing. It is well-suited for automotive, industrial and commercial IoT applications.

Block Diagram

i.MX 952 Applications Processor

i.MX 952 Applications Processor Block Diagram
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Features

Multicore Processing

  • 4x Arm® Cortex®-A55
  • 1x Arm Cortex-M7
  • 1x Arm Cortex-M33
  • NXP eIQ NPU

Memory

  • Up to 6000 Megatransfers per second (MT/s) x32 Low-Power Double Data Rate 5 (LPDDR5) or up to 4266 MT/s x32 Low-Power Double Data Rate 4X (LPDDR4X): Error-correcting code (ECC) and encryption
  • 3x micro Secure Digital High Capacity (uSDHC): Secure digital 3.0 (SD3.0), Secure Digital Input/Output 3.0 (SDIO3.0) and embedded MultiMediaCard 5.1 (eMMC5.1)
  • XSPI with in-place execute-on-DRAM (IPED), with support for serial peripheral interface (SPI) NOR and SPI NAND flash memories

Connectivity

  • 1x 2.5Gbit/s and 2x 1Gbit/s Ethernet with time-sensitive networking (TSN); audio video bridging (AVB) and IEEE 1588 for sync; energy-efficient ethernet (EEE)
  • 1x Peripheral Component Interconnect express (PCIe) Gen 3.0 (1-lane); 2x USB2.0 with physical layer (PHY)
  • 2x 32-pin flexible input/output (FLEXIO) interface (bus or serial I/O)
  • 8x universal asynchronous receiver/transmitter (UART); 8x low-power serial peripheral interface (LPSPI); 8x Low-Power Inter-Integrated Circuit (LPI2C); 2x improved inter-integrated circuit (13C); 3x controller area network flexible data-rate (CAN-FD)

Packaging

  • 19x19mm flip-chip ball grid array (FCBGA), 0.7mm pitch; and 15x15mm, hybrid pitch

Temperature Range

  • Automotive -40°C ambient temperature (Ta) to 125°C junction temperature (jt)
  • Extended Industrial -40°C Ta to 125°C Tj
  • Industrial -40°C Ta to 105°C Tj
  • Commercial 0°C Ta to 90°C Tj

General

  • Functional Safety: IEC61508 (SIL 2) for Industrial and ISO26262 (ASIL B) for Automotive
  • Security: EdgeLock Secure Enclave (Advanced Profile); EdgeLock Prime Accelerator; Post Quantum Cryptography (PQC)

Graphics

  • 3D GPU: OpenGL® ES 3.2, Vulkan® 1.2, OpenCL™ 3.0
  • 2D GPU

Video

  • Video Decode: 4k30, h.265/4
  • Video Encode: 4k30 h.264

Display Interfaces

  • 350 MHz MIPI-DSI (4-lane, 2.5 Gbit/s/lane) supporting 4kp30 or 3840x1440p60
  • Up to 1080p60 LVDS Tx (2x 4-lane or 1x 8-lane)

Camera Interfaces

  • MIPI-CSI and ISP (1x 4-lane or 2x 2-lane, 2.5 Gbit/s/lane) with PHY
  • Up to 1x4Kp60fps, 2x4Kp30, 4x1080p60 cameras with MIPI virtual channels

Audio

  • 17x I²S TDM (32-bit @ 768kHz), SPDIF Tx/Rx
  • 8 channel PDM microphone input
  • MQS: Medium Quality Sound output (sigma-delta modulator)

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